Board types · 04

High-frequency laminates: Rogers, Taconic, F4B

Above a few hundred megahertz the laminate stops being a passive substrate. Its dielectric constant sets how wide a 50-ohm trace has to be, and its loss tangent decides how much of the signal reaches the far end.

  • MaterialsRogers, Taconic, F4B
  • Layers1 – 32
  • Impedance controlListed process
  • Min line/space0.06 / 0.06 mm
At a glance: high-frequency boards on Rogers, Taconic and F4B laminate, 1 to 32 layers, 0.06 mm minimum line and spacing, impedance control on the process list, boards up to 650 × 1,100 mm, with ENIG, immersion silver or OSP as the finishes that suit them.

When FR-4 stops being good enough

Above a few hundred megahertz the laminate stops being a passive substrate and becomes part of the circuit.

FR-4 has a dielectric constant around 4.2 to 4.6 and a loss tangent around 0.02, and both vary from batch to batch. At 100 MHz that is invisible. Above roughly a gigahertz two things happen: the wavelength gets short enough that a 10% spread in Dk moves a supposedly 50-ohm trace outside spec, and the loss tangent turns into an amount of signal that measurably never arrives at the far end.

High-frequency laminates are sold on those two numbers. PTFE-based materials run Dk around 2.2 to 3.5 with loss tangents in the 0.001 to 0.004 range; hydrocarbon and thermoset products sit between them and FR-4. Those are ranges from the laminate suppliers' datasheets, not measurements of our process — and the sheet for the exact grade you buy is the one the board has to be designed against.

Which is the ordering constraint people get wrong: the laminate has to be picked before the stackup, because the trace widths follow from its Dk. A Gerber drawn on FR-4 assumptions and then moved to Rogers is a re-layout, not a material substitution.

What the datasheet numbers actually decide

Four figures on a laminate datasheet, and what each one costs you if it is off.

What each datasheet figure decides
Datasheet figureWhat it decidesWhat happens when it is wrong
Dk — dielectric constant How wide a 50-ohm trace has to be on a given dielectric thickness. A 10% error in Dk moves the impedance by several ohms. On a tightly controlled net that is a failing coupon, and a re-spin.
Df — loss tangent How much signal is absorbed per unit length. It accumulates with length, so a short board can hide a bad choice that a long one exposes. This is the number that separates FR-4 from PTFE laminate.
Dk tolerance and batch consistency Whether the impedance holds across production, not only on the first article. It is the difference between a design that yields and one that needs impedance coupons on every lot.
CTE and Tg Whether the vias and the BGAs survive reflow and thermal cycling. A laminate that is right electrically can still crack a via barrel, especially on a thick board with a high layer count.

Copper roughness is the one that surprises people: at high frequency the current crowds to the surface, so a foil with a rough profile has a longer electrical path than a smooth one, and the difference shows up as loss rather than as impedance. It is a property of the copper on the laminate, which is why two suppliers quoting "the same" Dk can still deliver different loss.

The stackup is the quote

We do not publish a single impedance tolerance, because it is not a property of the plant — it is a property of the stackup you send.

Trace width, dielectric thickness, the Dk tolerance of the laminate and the copper roughness all move the impedance together. A stackup with a tight Dk and a well-controlled dielectric can hold a few percent; the same plant with a loose laminate and a thick dielectric cannot, whatever the process claims. So the drawing fixes it: which layers carry controlled impedance, what the target is, and what the tolerance has to be.

Send four things with the Gerber — the stackup, the nets that need control, the impedance target and tolerance, and the finish. Impedance control is on our process list; ENIG, immersion silver and OSP are the finishes that suit a high-frequency board, and all three are on the finish list. The finish comparison covers when each one is the wrong choice.

High-frequency fabrication limits

The processing side is the same as the rest of the plant. What the laminate changes is the stackup, not the drill or the finish list.

High-frequency fabrication limits
Base materialFR4, CEM1, CEM3, High TG, Rogers, F4B, Taconic, FR1, FR2, 94V0, aluminium
Layer count1 – 32 layers
Minimum line width / spacing0.06 mm / 0.06 mm
Impedance controlOn the special-process list
Board thickness0.2 – 8.0 mm ± 10%
Copper weight0.5 oz – 12 oz
Maximum board dimensions650 mm × 1,100 mm (25.6 in × 43.3 in)
Minimum drill hole diameter0.1 mm
Surface finishENIG, immersion silver and OSP are the ones a high-frequency board usually takes; HASL, immersion tin, ENEPIG, electrolytic hard gold, gold fingers and ENIG + OSP are also available
Special processesHalf holes, bonding, impedance control, metal cladding, resin plug holes, blue glue, carbon ink, blind routing, blind and buried vias
Quality standardIPC-A-600F / MIL-STD-105D
Order quantity1 – 500,000

Where a high-frequency board fits, and where it does not

A high-frequency laminate is right if…

You want a different family if…

The design runs at or above about a gigahertz, or the loss budget is already tight at a lower frequency.
The board is digital at a few hundred megahertz with short traces. FR-4 holds that, and the laminate premium buys nothing.
The impedance has to be held across production, not just on the first article, and the Dk of FR-4 is too loose to do it.
You need a cheap board for a one-off evaluation and the loss budget has 20 dB of headroom. Start on FR-4 and change only if the measurement says so.
You already know the Dk the layout was drawn against and the laminate has to match it.
The connector, the cable and the antenna are all FR-4-grade anyway. The board is not the limiting component, and the money is better spent there.

If the design also needs a 0.4 mm-pitch BGA fanned out, the routing goes with HDI rather than with the laminate choice. Compare the five board types.

Same plant, other families: FR-4 and high-TG rigid · HDI build-up · flexible and rigid-flex · aluminium and heavy copper.

Common questions

Do you build boards on Rogers and Taconic laminate?

Yes. Rogers, Taconic and F4B are on our base-material list, alongside FR4, high TG, CEM1, CEM3, FR1, FR2, 94V0 and aluminium, from 1 to 32 layers.

Can you hold a controlled impedance on FR-4?

Yes — impedance control is on our process list and FR-4 supports it at lower frequencies. What FR-4 cannot do is hold the tolerance at multi-gigahertz edge rates, because its dielectric constant varies too much between batches.

What impedance tolerance can you hold?

That is set by the stackup rather than published as a single number: trace width, dielectric thickness, Dk tolerance and copper roughness all move it together. Send the stackup and the nets that need control, and the tolerance comes back with the quote.

Which surface finish should a high-frequency board use?

ENIG, immersion silver or OSP — all three are on our finish list and all three suit a high-frequency board. HASL's uneven surface is the one to avoid once the pitch gets fine.

How many layers can a high-frequency board have?

One to 32, the same range as everything else we fabricate. What changes with the laminate is the stackup, not the layer count.

The laminate is chosen before the stackup

A Gerber drawn on FR-4 assumptions and moved to Rogers is a re-layout, not a material substitution. Send the stackup and the nets that need control, and the trace widths come back fixed to the laminate you buy.

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